三軸半自動焊線機 WB-300-U
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Semiautomatic Wire Bonder WB-300-U

SKU: WB-300-U Categories: , Tag:
  • Brand：德國UNITEMP
  • Very compact table top unit, mouse controlled x,y,z-axis
  • Wedge/Ball and secure Ball Bonding with gold or aluminium wire (17…50 µm)
  • Motorzed Deep Access Bondhead: Z-axis 50 mm, Accuracy 1.0 μm, Bond arm length 165 mm
  • Motorized x-y table: Fine table motion 50 x 50 mm, Accuracy 1.0 μm
  • Optional: microscope / binocular

Specification

ModelWB-300-U
Bond methodsWedge, Ball, Bump and secure Ball bonding
Gold / Aluminium wire diameter17 – 50 μm
Ultraonic systemPLL控制62 kHz，功率2 W
Bond Time5 – 5000 msec.
Bond Force5 – 100 cN
SensorWedge and Ball Transducer
Bond Tool1.58 dm × 19 mm (0.0626″ × 0.750″)
Motorized AxesZ-axis 40 mm，Y-axis 50 mm，X-axis 50 mm
Power Supply100 – 240 V，50 – 60 Hz，Max. 5 A
Dimension580 × 510 × 490 mm
Weight45 kg

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