Solder-Paste Tackiness Tester TK-1S

  • Brand:日本MALCOM
  • Compliant to JIS, IEC & ANSI standard.
  • Measure the adhesive strength of materials such as solder paste. Measurement items: Tackiness, Load and Insertion Depth.
  • There are three insertion methods, making it possible to measure under the conditions closer to the actual mounting manner.
  • It is useful to feed back the difference of the tackiness obtained by changing the set conditions to the production site in a timely manner.

Specification

ModelTK-1S
Load SensorRange : 0~400gf±2gf Resolution : 0.25gf
Measurement Methods(1) Continuous preload, JIS
(2) Insertion depth
(3) Point preload, IPC
Parameters Measured(1) Tackiness : T gf
(2) Real Preload : P gf
(3) Real Insert depth : D μm
Preset Ranges(1) Preload : -20 ~ -400gf
(2) Time : 0.1 ~ 99.9s
(3) Speed : 1.0 ~ 10.0mm/s (Continuous preload / Insertion depth)
2.0 ~ 600.0mm/min (Point preload)
(4) Depth : 20 - 200μm
(5) Temperature : Room temp. +10℃ - 250℃
Digital OutputRS232C
Weight約10kg

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