Solder-Paste Wetting Tester SP-2

  • Brand:日本MALCOM
  • Can test and evaluate solder paste, PC board and parts-lead.
  • All wetting process can be observed from glass windows.
  • "Wetting Balance Measuring Method","Micro-Wetting Balance Measuring Method", and "Quick Heating Method" are possible optionally.
  • Can simulate reflow oven profile with hot air and N2 purge.
  • Electro-balance sensor adopted allows detection of very small force.The wettability of microchips can now be examined by this unit.
  • Analyze wetting time and force with exclusive software.
  • Solder wire testing is also available.

Specification

ModelSP-2
Load Sensor測量範圍10.00gf~-5.00gf 測量精度±(10mgf +1位數)
解析度900 mgf以下:0.001 gf 900 mgf以上:0.005 gf
Temperature Sensor測量範圍0~300℃,測量精度±3℃
Heater CapacityRoom temperature ~ 300℃. Simple closed heater unit with nipple for N2 purge test
Temp. Profile Setting1. Preheat temp. 2. Preheat time 3. The rate of temp. rise 3℃ /sec. (standard)
4. Maximum temp. 5. Maximum temp. time
Melting PointPreset solder paste melting point
Table MovementAutomatic: operated by PC, Manual: operated by Up/Down switch (selectable 3 steps speed)
Digital OutputRS-232C(Malcom格式)
Air Supply原始氣壓:0.2~0.5 Mpa(約2~5 kgf/cm²)
調節空氣:0.2 Mpa(約2kgf/cm²)
Power SupplyAC 100V 50/60Hz 700W
Weight約 20kg

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