品牌－SSP

Showing all 24 results

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  APP (Auto Pick and Place for Unit Package)

  Rated 0 out of 5

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  ASA-7200V (Auto Stiffener & Lid Attach System with Cure)

  Rated 0 out of 5

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  ASL-6000 (Auto Jig & Strip Loader System with Laser Marking)​

  Rated 0 out of 5

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  ASU-6000 / ASU-7000 (Auto Jig & Strip Unloading system)

  Rated 0 out of 5

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  ASU-LX2(Auto Strip Unloader System with X-Marking)

  Rated 0 out of 5

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  BPS (Ball Placement System for Strip)

  Rated 0 out of 5

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  BPS (Ball Placement System for Unit Package – Dual ball)

  Rated 0 out of 5

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  BPS (Ball Placement System for Unit Package)

  Rated 0 out of 5

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  BRS (Ball Rework & 3 rd Ball Mount System f or Unit Package)

  Rated 0 out of 5

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  BUS -5000V (Strip Unloading System With Vision) BUS -7000 (Strip Unloading System)

  Rated 0 out of 5

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  CHS-CL1 (Top Plate Loader System for JEDEC Tray)

  Rated 0 out of 5

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  CHS-CU1 (Top Plate Unloader System for JEDEC Tray)

  Rated 0 out of 5

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  DAL-T1 (Auto Tim & Lid Attach System)

  Rated 0 out of 5

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  DAP-423 (Auto Dispensing & Lid Attach System with Cure)

  Rated 0 out of 5

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  DAS-6230S (Auto Dispense & Holder Attach System with Snap Cure)

  Rated 0 out of 5

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  FPS -7200V / FPS- 8100V (Flux Pre-Cleaning System For Substrate Strip)

  Rated 0 out of 5

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  LCS-PMV(Lid Cleaning System)

  Rated 0 out of 5

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  MCS-P2(Post Mold Cure System)

  Rated 0 out of 5

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  MPD(Multi Pin Dotting)

  Rated 0 out of 5

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  Panel Level Ball Drop & Rework System

  Rated 0 out of 5

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  TAS-1000 (Tape Attach System)

  Rated 0 out of 5

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  TDS-1000 (Tape De – attach System for Unit Package)

  Rated 0 out of 5

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  TDS-2000(Tape Detach System for Strip / Carrier Jig)

  Rated 0 out of 5

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  wBPS -DR1 (Ball Placement System For PLP / Wafer)​

  Rated 0 out of 5