金剛石劃線機 MS-1
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Precision Diamond Scriber MS-1

SKU: MS-1 Category: Tag:
  • Brand：德國UNITEMP
  • This reliable Diamond Scriber performs fast, easy and precise scribing and cutting of silicon wafers, as well as thin- and thick film ceramic and glass substrates. It forms the grooves necessary for effective glass or ceramic cutting: shallow, even and coninuous.
  • All essential operating parameter - the angle of the scribing tool, the scribing force, the touchdown point and the lift up point of the tool are precisely adjustable to ensure optimal flexibility and repeatable results.
  • The scriber has got a rotatting Z table with universal vacuum chuck for any size wafers up to 8" dia or ceramic substrates up to 8" x8 ".
  • The scribing tool touches down the substrate or wafer surface on an adjustable touchdown point and is automatically lifted after leaving the scribing area. The lift-up point is adjustable too.

Specification

ModelMS-1
Loading areafor wafer size up to 8" or substrate size 200 x 200 mm
X/Y adjustmentby micrometer screw and X-Y table
Vision-alignment Systemcamera with 5 Megapixel
Vacuumwith integrated vacuum pump and chuck
Dimension400 × 500 × 352 mm
Weight25 kg

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