VJ Electronix 400ST為鍍通孔(PTH)組件的返修提供了一種可控的對流加熱工藝。采用該工藝可有效避免傳統噴錫爐返修方式存在的鍍銅分解缺陷。經過多個返修周期也可以保護鍍銅通孔孔壁不被銅分解。

    通過利用VJE三級加熱技術，400ST可在所有印刷線路板，包括大型、厚重基板上進行安全的PTH元件移除、返修區涂敷及元件替換。紅外分區陣列底部加熱可對整塊基板進行處理，並將熱應力最小化，防止板彎。在整個周期中，局部閉環對流頂部及底部加熱可始终提供安全、可靠的熱曲線控制。

    400ST利用VJE自動化動態高度感應(DHS)清除器在元件拆除後清潔孔壁。電動的X、Y及Z軸動作在消除過度加熱風險的同時可頂保结果的一致性。DHS清除間隙控制及可編程頂端力度的结合有效保護了基板表面。

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The VJ Electronix 400ST provides a controlled convective heating process for rework of Plated Through Hole (PTH)devices. The convection process eliminates copper dissolution issues users experience with traditional Solder Fountain rework methods. Plated Through Hole barrels are protected through multiple rework cycles.

Using VJE’s Triple Stage Heating technology, the 400STsafely provides PTH component removal, site dressing and component replacement on all PWB types including large, high mass boards. Infrared area array bottom heating conditions the entire board and minimizes thermal stress. Localized closed-loop convection top and bottom heating provides safe, reliable thermal profile control throughout the cycle.

The 400ST prepares barrels for component replacement using VJE’s automated Dynamic Height Sensing (DHS)Scavenger solder removal. Motorized X, Y, and Z motions assure consistent results while eliminating risk of overexposure. The combination of DHS Scavenging gap controland programmable tip force protect the board surface.