Summit 1100 是 V.J. Electronix Summit 系列的基本返修系統。它集成自高水平、半自動表面貼裝返修技術發明以來的所有創新功能於一體，包括微電子返修。

    廣泛的现場經驗和與用戶的合作使得該系統日益超越了業界的日常使用預期。特有的SierraMate^TM 軟件具有直觀的“1-2-3-GO”操作界面和自動生成温度曲線的功能，不僅使系統更便於使用, 而且能夠進行與分區陣列組件(BGA，微型BGA，倒裝片等)有關的複雜返修工作。

    Summit 1100 返修工作站具備可靠的無铅性能。它能夠操作大型 (18" x 22"/ 457 x 610mm) 組件和各種尺寸的元件，加上其杰出的熱性能和光學特性，該系統已成為電子製造業界的頂尖設備，同時也是所有其它同類設備爭相效仿的標准。

欲了解更多性能和技術規範，請下載產品說明(ENGLISH) /(中)。

Summit 1100 Rework System

The Summit 1100 is the benchmark rework system for VJ Electronix Summit series. It incorporates all of the innovative features that have been developed since the invention of high-level, semi-automatic surface mount rework technology, including microelectronics rework. Extensive field experience and cooperation with users have resulted in a system that more than satisfies the day-to-day needs of the industry. SierraMateTM software with intuitive 1-2-3-GO operator interface and Auto Profile, makes the system easy to use, but capable of performing the most complex of tasks associated with the rework of Area Array components (BGA's, Micro BGA's, Flip Chips, etc.). The Summit 100 rework station is Lead-Free Proven. Its ability to handle large (18" x 22"/ 457 x 610mm) assemblies and a wide range of component sizes, plus its outstanding thermal and optical characteristics, make the system the workhorse of the electronics manufacturing industry and the standard to which all others aspire.