Summit 750 系統是為以較低的价格而要求Summit 1800高性能的用戶開發的。這是在不犧系統基本性能的前提下將一些自動化功能轉換成手工操作來實現的。該系統的能力包括 QFP 和 BGA 返修。

Summit 750的熱、光學和軟件性能不僅具有高可靠性且便於使用，能夠像Summit 1100一樣處理大型組件 (18” x 22”)及各種元件。

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The Summit 750 system was developed for users who demand the high performance characteristics of the Summit 1800 at a lower price.  This has been achieved by converting some of the automated functions to manual operations without sacrificing the essential capabilities of the system.  The system’s capabilities include QFP and BGA rework.

The Summit 750’s thermal, optical, and software features provide high reliability and ease of use together with the capability to handle the same large assemblies (18” x 22”) and wide range of components as the Summit 1100